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发明授权
US5517162A Dielectric resonator including a plurality of solder bumps and method of mounting dielectric resonator 失效
包括多个焊料凸块的介质谐振器和安装介质谐振器的方法

Dielectric resonator including a plurality of solder bumps and method of mounting dielectric resonator
摘要：
A dielectric resonator device includes a dielectric member, inner conductors provided in the dielectric member, an outer conductor formed on an outer surface of the dielectric member, signal input and output electrodes formed on the outer surface of the dielectric member opposing a mounting substrate and coupled with the inner conductors, and solder bumps formed on the outer conductor on its surface opposing the mounting substrate and on the signal input and output electrodes. By heating the dielectric resonator device opposing the mounting substrate, electrical and mechanical connections may be made therebetween through the solder bumps, while preventing the formation of solder bridges.
摘要（中）：

介质谐振器装置包括电介质构件，设置在电介质构件中的内导体，形成在电介质构件的外表面上的外导体，形成在与安装基板相对的电介质构件的外表面上的信号输入和输出电极， 其内部导体和形成在其表面上的外部导体上的焊料凸块相对于安装基板和信号输入和输出电极。 通过加热与安装基板相对的介质谐振器装置，可以通过焊料凸块在其间形成电气和机械连接，同时防止形成焊接桥。

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