发明授权
- 专利标题: Process for forming a butting contact through a gate electrode
- 专利标题(中): 用于通过栅电极形成对接接触的工艺
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申请号: US405078申请日: 1995-03-16
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公开(公告)号: US5521113A公开(公告)日: 1996-05-28
- 发明人: Chen-Chiu Hsue , Sun-Chieh Chien
- 申请人: Chen-Chiu Hsue , Sun-Chieh Chien
- 申请人地址: TWX Hsinchu
- 专利权人: United Microelectronics Corporation
- 当前专利权人: United Microelectronics Corporation
- 当前专利权人地址: TWX Hsinchu
- 主分类号: H01L27/11
- IPC分类号: H01L27/11 ; H01L21/70 ; H01L27/00
摘要:
An SRAM cell includes a semiconductor substrate doped with a dopant of a first type, a highly doped region in the substrate implanted with a dopant of opposite type, a gate oxide layer on the substrate, a first conductive layer formed upon the gate oxide layer, a dielectric layer deposited over the first conductive layer, an opening in the gate oxide layer, the first conductive layer, and the dielectric layer, and a second conductive layer deposited upon the dielectric layer.
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