发明授权
US5523259A Method of forming metal layers formed as a composite of sub-layers using
Ti texture control layer
失效
使用Ti纹理控制层形成作为子层的复合物的金属层的方法
- 专利标题： Method of forming metal layers formed as a composite of sub-layers using Ti texture control layer
- 专利标题（中）： 使用Ti纹理控制层形成作为子层的复合物的金属层的方法
-
申请号： US349649申请日： 1994-12-05
-
公开(公告)号： US5523259A公开(公告)日： 1996-06-04
- 发明人: Sailesh M. Merchant , Arun K. Nanda , Pradip K. Roy
- 申请人： Sailesh M. Merchant , Arun K. Nanda , Pradip K. Roy
- 申请人地址： NJ Murray Hill
- 专利权人： AT&T Corp.
- 当前专利权人： AT&T Corp.
- 当前专利权人地址： NJ Murray Hill
- 主分类号： H01L21/28
- IPC分类号： H01L21/28 ; H01L21/3205 ; H01L21/768 ; H01L23/52 ; H01L23/522 ; H01L23/532
摘要：
In an integrated circuit, an opening (e.g., via or window) is filled with an Al-based plug which has essentially a orientation and comprises at most three grains. These characteristics are achieved by first depositing a texture control Ti layer having substantially a (002) basal plane orientation followed by at least three Al-based sublayers. The grain sizes and deposition conditions are controlled in such a way that during deposition of the third sublayer, the microstructure of the plug adjusts itself to produce a single grain (or at most three).
公开/授权文献
- US4939116A Thermosensitive recording material 公开/授权日：1990-07-03
信息查询
IPC分类:
