Invention Grant
- Patent Title: Method for the assembly of an electronic package
- Patent Title (中): 电子封装的组装方法
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Application No.: US126862Application Date: 1993-09-27
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Publication No.: US5540378APublication Date: 1996-07-30
- Inventor: Deepak Mahulikar , Arvind Parthasarathi
- Applicant: Deepak Mahulikar , Arvind Parthasarathi
- Applicant Address: CT New Haven
- Assignee: Olin Corporation
- Current Assignee: Olin Corporation
- Current Assignee Address: CT New Haven
- Main IPC: H01L23/28
- IPC: H01L23/28 ; H01L21/56 ; H01L23/495 ; H01L23/50 ; H05K3/34 ; H01L21/58 ; H01L23/532
Abstract:
There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.
Public/Granted literature
- US6079292A Method and apparatus for leather wrapping of a steering wheel Public/Granted day:2000-06-27
Information query
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