发明授权
- 专利标题： Method for the assembly of an electronic package
- 专利标题（中）： 电子封装的组装方法
-
申请号： US126862申请日： 1993-09-27
-
公开(公告)号： US5540378A公开(公告)日： 1996-07-30
- 发明人: Deepak Mahulikar , Arvind Parthasarathi
- 申请人： Deepak Mahulikar , Arvind Parthasarathi
- 申请人地址： CT New Haven
- 专利权人： Olin Corporation
- 当前专利权人： Olin Corporation
- 当前专利权人地址： CT New Haven
- 主分类号： H01L23/28
- IPC分类号： H01L23/28 ; H01L21/56 ; H01L23/495 ; H01L23/50 ; H05K3/34 ; H01L21/58 ; H01L23/532
摘要：
There is disclosed a process for the assembly of an electronic package in which the outer lead ends of a leadframe are solderable to external circuitry without the necessity of a tin or solder coat. An oxidation resistant layer is deposited on the leadframe prior to package assembly. The oxidation resistant layer is removed prior to outer lead soldering providing a clean, oxide free metallic surface for soldering.
公开/授权文献
- US6079292A Method and apparatus for leather wrapping of a steering wheel 公开/授权日：2000-06-27
信息查询
IPC分类:
