Invention Grant
- Patent Title: Apparatus to minimize stiction in micromachined structures
- Patent Title (中): 用于最小化微机械结构中的静摩擦的装置
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Application No.: US348377Application Date: 1994-12-01
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Publication No.: US5542295APublication Date: 1996-08-06
- Inventor: Roger T. Howe , H. Jerome Barber , Michael Judy
- Applicant: Roger T. Howe , H. Jerome Barber , Michael Judy
- Assignee: Analog Devices, Inc.
- Current Assignee: Analog Devices, Inc.
- Main IPC: B81B3/00
- IPC: B81B3/00 ; G01P15/08 ; G01P15/125
Abstract:
An electro-mechanical micromachined structure uses bumpers to prevent contact between structures at different potentials. A beam is connected to one or more anchors by flexible suspensions, which permit the beam to move along a predetermined axis relative to one or more plates. The suspension includes at least one bumper positioned so that the bumper will contact another part of the suspension before the beam contacts the plates. The bumper is made from the same material as the suspension, during the same processing step. The bumper is positioned to take advantage of shrinkage or expansion of the beam during processing which forces the bumper closer to its contact point then would otherwise be possible.
Public/Granted literature
- US4964353A Windsurfer sail Public/Granted day:1990-10-23
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