发明授权
- 专利标题: Semiconductor wafer processing system
- 专利标题(中): 半导体晶圆处理系统
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申请号: US236424申请日: 1994-04-28
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公开(公告)号: US5544421A公开(公告)日: 1996-08-13
- 发明人: Raymon F. Thompson , Robert W. Berner , Gary L. Curtis , Stephen P. Culliton , Blaine G. Wright
- 申请人: Raymon F. Thompson , Robert W. Berner , Gary L. Curtis , Stephen P. Culliton , Blaine G. Wright
- 申请人地址: MT Kalispell
- 专利权人: Semitool, Inc.
- 当前专利权人: Semitool, Inc.
- 当前专利权人地址: MT Kalispell
- 主分类号: B65G49/07
- IPC分类号: B65G49/07 ; H01L21/00 ; H01L21/673 ; H01L21/677 ; F26B17/24
摘要:
A processor for processing integrated circuit wafers, semiconductor substrates, data disks and similar units requiring very low contamination levels. The processor has an interface section which receives wafers in standard wafer carriers. The interface section transfers the wafers from carriers onto trays for processing. The interface unit can hold multiple groups of multiple trays. A conveyor having an automated arm assembly moves wafers supported on a tray. The conveyor moves the trays from the interface along a track to several processing stations. The processing stations are accessed from an enclosed area adjoining the interface section.
公开/授权文献
- US4923777A Single-component developing method 公开/授权日:1990-05-08
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