发明授权
US5545465A Circuit board having a defined volume of solder or conductive adhesive
deposited at interconnection sites for electrical circuits
失效
具有限定体积的焊料或导电粘合剂的电路板沉积在用于电路的互连位置处
- 专利标题: Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits
- 专利标题(中): 具有限定体积的焊料或导电粘合剂的电路板沉积在用于电路的互连位置处
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申请号: US449029申请日: 1995-05-24
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公开(公告)号: US5545465A公开(公告)日: 1996-08-13
- 发明人: Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
- 申请人: Michael A. Gaynes , George D. Oxx , Mark V. Pierson , Jerzy Zalesinski
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: B05C5/02
- IPC分类号: B05C5/02 ; B23K3/06 ; H01L21/48 ; H01L21/60 ; H05K3/12 ; H05K3/32 ; H05K3/34 ; B32B9/00
摘要:
A method of applying bonding agents, such as solder pastes and conductive adhesives, to pad sites in the manufacture of electronic circuits uses a paste injection head. A permanent mask with cavity openings is applied around conductive pads on a carrier. The conductive pads correspond to chip attachment sites. The injection head is brought into contact with a surface of the mask, and pressure is applied to a bonding agent in the injection head. The injection head is then moved over the surface of the mask, filling cavity openings with the bonding agent. The injection head is then removed from the surface of the mask. If a solder paste is used, infrared radiation is applied to filled cavity openings to evaporate a paste flux and reflow solder to form solder balls within the cavity openings projecting above the mask. If a conductive adhesive is used, a stencil is applied to the surface of the mask prior to contacting the mask with said injection head. When the cavity openings are filled, stencil is removed from the mask and the conductive adhesive filling the cavity openings is dried.
公开/授权文献
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