发明授权
- 专利标题： Method of manufacturing a ceramic substrate
- 专利标题（中）： 制造陶瓷基板的方法
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申请号： US189482申请日： 1994-01-31
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公开(公告)号： US5547530A公开(公告)日： 1996-08-20
- 发明人: Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
- 申请人： Yoshifumi Nakamura , Yoshihiro Bessho , Satoru Yuhaku , Yasuhiko Hakotani , Minehiro Itagaki , Kazuhiro Miura
- 申请人地址： JPX Kadoma
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Kadoma
- 优先权： JPX5-015203 19930202
- 主分类号： H01L21/48
- IPC分类号： H01L21/48 ; H05K1/03 ; H05K1/09 ; H05K3/40 ; H05K3/46 ; B32B31/04 ; B32B31/12 ; B32B31/24 ; C04B41/81
摘要：
The method of manufacturing a ceramic substrate having a plurality of bumps of the present invention, includes the steps of: forming a bump forming layer having a plurality of holes therein on at least one of upper and lower faces of a laminated body of green sheets; filling the holes in the bump forming layer with a bump forming paste; sintering the laminated body of the green sheets and the bump forming paste; and forming bumps made of the sintered bump forming paste by removing the bump forming layer.
公开/授权文献
- US4849193A Process of preparing hydroxylapatite 公开/授权日：1989-07-18
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