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    Conductive ink
    1.
    发明授权
    Conductive ink 失效
    导电油墨

    公开(公告)号：US5407473A

    公开(公告)日：1995-04-18

    申请号：US174807

    申请日：1993-12-29

    申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    IPC分类号： H01B1/14 ,  H01L23/498 ,  H05K1/09 ,  C09D11/02

    CPC分类号： H01B1/14 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/092

    摘要： Conductive ink has an inorganic compound comprising 70.0-95.0 wt. % of CuO which is conductive and 5.0-30.0 wt. % of inorganic binder mixed with each other, and solvent and organic binder in which the inorganic compound is dispersed. The inorganic binder consists of lead borosilicate crystalline glass or aluminum borosilicate crystalline glass soften and crystallizes at 850.degree.-950.degree. C. The diameter of CuO powder of the inorganic compound is 100-7.0 .mu.m. The diameter of the lead borosilicate crystalline glass powder or the aluminum borosilicate crystalline glass powder of the inorganic compound is 1.0-5.0 .mu.m. The organic binder consists of ethyl cellulose or copolymer of polyisobytylmethacrylate and poly.alpha.-methylstyrene. The conductive ink contains the organic binder at 0.5-2.0 wt. %.

    摘要翻译： 导电油墨具有70.0-95.0重量％的无机化合物。 导电的CuO％和5.0-30.0wt。 相互混合的无机粘合剂的％，以及其中分散无机化合物的溶剂和有机粘合剂。 无机粘合剂由硼硅酸铅晶体玻璃或硼硅酸铝晶体玻璃软化并在850-950℃下结晶。无机化合物的CuO粉末的直径为100-7.0μm。 硼硅酸铅晶体玻璃粉末或无机化合物的硼硅酸铝结晶玻璃粉末的直径为1.0-5.0μm。 有机粘合剂由乙基纤维素或聚甲基丙烯酸异丁酯和聚α-甲基苯乙烯的共聚物组成。 导电油墨含有0.5-2.0重量％的有机粘合剂。 ％。

    Method of making multi-layered ceramic substrates
    4.
    发明授权
    Method of making multi-layered ceramic substrates 失效
    制作多层陶瓷基板的方法

    公开(公告)号：US5662755A

    公开(公告)日：1997-09-02

    申请号：US526312

    申请日：1995-09-11

    申请人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    发明人： Kazuhiro Miura ,  Yoshihiro Bessho ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Minehiro Itagaki ,  Yoshifumi Nakamura ,  Akihiko Miyoshi

    IPC分类号： H01L21/48 ,  H01L23/15 ,  H05K3/24 ,  B32B31/26 ,  B32B31/12

    CPC分类号： H05K3/248 ,  H01L21/4857 ,  H01L23/15 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K2203/308 ,  H05K3/4629 ,  Y10T29/49163

    摘要： A method of making a multi-layered ceramic substrate which includes the steps of laminating a desired number of green sheets each being made of glass ceramics containing at least an organic binder and a solvent and each having a pattern of electrodes formed thereon by the use of an electroconductive paste, to thereby provide a green sheet laminate, The electrodes on opposite surfaces or an entire surface layer of the green sheet laminate are subsequently printed with a paste comprising an inorganic component added with at least an organic binder containing a Zn composition. On each surface of the laminate printed with the paste of the Zn composition, a green sheet made of an inorganic composition incapable of being sintered at a temperature of crystallization of the glass ceramics is then laminated thereby providing a laminate plate which is subsequently fired. After the firing, both of the inorganic composition incapable of firing sintered and the Zn composition are removed from the opposite surfaces of the laminate. The paste of the Zn composition may contains a main component selected from the group consisting of Zn, ZnO, Zn(OH).sub.2, ZnAl.sub.2 O.sub.4, and ZnCO.sub.3.

    摘要翻译： 一种制造多层陶瓷基板的方法，其包括以下步骤：将所需数量的生坯片材层叠，所述生坯片材由至少含有有机粘合剂和溶剂的玻璃陶瓷制成，并且各自具有通过使用 导电糊，从而提供生片层压体。随后用包含添加至少含有Zn组合物的有机粘合剂的无机组分的糊料印刷相对表面上的电极或生片层压体的整个表面层。 在印有Zn组合物的糊料的层压板的每个表面上，将由玻璃陶瓷的结晶温度下不能烧结的无机组合物制成的生片层叠，从而提供随后烧制的层压板。 烧成后，从层叠体的相对面除去无法烧成的无机组合物和Zn组合物。 Zn组合物的糊剂可以含有选自Zn，ZnO，Zn（OH）2，ZnAl 2 O 4和ZnCO 3的主要成分。

    Method for producing multilayered ceramic substrate
    8.
    发明授权
    Method for producing multilayered ceramic substrate 失效
    多层陶瓷基板的制造方法

    公开(公告)号：US5370759A

    公开(公告)日：1994-12-06

    申请号：US60981

    申请日：1993-05-14

    申请人： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Tsuneharu Katada ,  Satoru Yuhaku ,  Kazuhiro Miura ,  Yoshifumi Nakamura

    发明人： Yasuhiko Hakotani ,  Seiichi Nakatani ,  Tsuneharu Katada ,  Satoru Yuhaku ,  Kazuhiro Miura ,  Yoshifumi Nakamura

    IPC分类号： H01L21/48 ,  H01L23/498 ,  B32B31/16 ,  B32B18/00

    CPC分类号： H01L23/49822 ,  H01L21/4857 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011

    摘要： A method for producing a multilayered ceramic substrate including the steps of:forming at least two green sheets each including a low-temperature firing glass-ceramic substrate material,forming an electrode pattern and a via hole electrode on and through each green sheet with a conductor paste,laminating said green sheets to obtain a laminate,forming a pair of green sheets which include an inorganic material which is not sintered at a firing temperature of the green sheet of the low-temperature firing glass-ceramic substrate material or lower, and then forming a hole through the inorganic material green sheet,laminating the inorganic material green sheet on the outermost green sheet of the laminate to obtain a resultant laminate in which the hole is positioned over a portion of the electrode pattern of an outermost low-temperature firing glass-ceramic green sheets of the laminate,firing said resultant laminate at the firing temperature, andremoving the unsintered inorganic material. The substrate does not shrink in its plane direction and surface smoothness, electrical resistance and solderability of the top layer wiring pattern are improved.

    摘要翻译： 一种多层陶瓷基板的制造方法，其特征在于，包括以下步骤：在导体上形成至少两个生坯片，每个生片包括低温焙烧玻璃陶瓷基板材料，在每个生片上形成电极图案和通孔电极， 糊状，层压所述生片以获得层压体，形成一对生片，其包括在低温焙烧玻璃 - 陶瓷基片材料的生片的烧成温度以下未烧结的无机材料，然后 通过无机材料生片形成孔，将无机材料生片层叠在层压体的最外层生片上，得到所得到的层叠体，其中孔位于最外层低温烧成玻璃的电极图案的一部分上 - 陶瓷生片，在烧成温度下焙烧所得到的层压体，除去未烧结的无机物 ial 基板在其平面方向上不收缩，并且提高了顶层布线图案的表面平滑度，电阻和可焊性。

    Multilayered ceramic substrate and method of manufacturing the same
    9.
    发明授权
    Multilayered ceramic substrate and method of manufacturing the same 失效
    多层陶瓷基板及其制造方法

    公开(公告)号：US5252519A

    公开(公告)日：1993-10-12

    申请号：US785750

    申请日：1991-10-31

    申请人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Yasuhiko Hakotani

    发明人： Seiichi Nakatani ,  Tsutomu Nishimura ,  Satoru Yuhaku ,  Yasuhiko Hakotani

    IPC分类号： H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H05K3/46 ,  H01L21/60

    CPC分类号： H05K1/092 ,  H01L23/49822 ,  H01L23/49883 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  Y10T29/4913

    摘要： A multilayered glass-ceramic substrate using copper as wiring material is fabricated by a step of forming wiring patterns with Au paste for connection of semiconductor chip prepared by adding at least one of Ni powder, Pt powder and Pd powder to Au powder, and copper oxide paste mainly composed of CuO powder, on a green sheet, and burning out the organic pattern by heat treatment in air, a step of reducing the copper oxide electrode by heat treatment in a reducing atmosphere containing hydrogen, and a step of sintering the substrate material, copper oxide electrode and gold electrode by heat treatment in nitrogen. Since the Au wiring pattern is formed on the top layer of the multilayered substrate in this constitution, wire bonding of high reliability is realized. Besides, by making use of the excellent solderability of Au, it may be also applied in flip-chip mounting of semiconductor. In addition, in this Au paste composition, the melting point of Au may be raised, and alloying or fusing is avoided if sintered at 900.degree. C. together with Cu electrode.

    摘要翻译： 使用铜作为布线材料的多层玻璃陶瓷基板通过以下步骤制造：用Au糊形成用于连接通过将Ni粉末，Pt粉末和Pd粉末中的至少一种添加到Au粉末中而制备的半导体芯片的布线图案和氧化铜 主要由CuO粉末组成的糊料，在生片上通过在空气中热处理而烧制有机图案，通过在含氢还原气氛中进行热处理来还原氧化铜电极的工序，以及烧结基板材料的工序 ，氧化铜电极和金电极通过在氮气中热处理。 在这种结构中，由于在多层基板的顶层上形成Au布线图形，所以实现了高可靠性的引线接合。 此外，通过利用Au的优异的可焊性，也可以应用于半导体的倒装芯片安装。 此外，在该Au糊剂组合物中，Au的熔点可以提高，如果在900℃下与Cu电极一起烧结，则避免合金化或熔融。

    Laminated ceramic capacitor
    10.
    发明授权
    Laminated ceramic capacitor 失效
    层压陶瓷电容器

    公开(公告)号：US5014158A

    公开(公告)日：1991-05-07

    申请号：US507568

    申请日：1990-04-11

    申请人： Tsutomu Nishimura ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Tatsuro Kikuchi

    发明人： Tsutomu Nishimura ,  Seiichi Nakatani ,  Satoru Yuhaku ,  Yasuhiko Hakotani ,  Tatsuro Kikuchi

    IPC分类号： C04B35/49 ,  H01G4/12

    CPC分类号： C04B35/49 ,  H01G4/1245 ,  Y10T29/435

    摘要： A laminated ceramic capacitor comprises a plurality of inner electrode layers for developing a capacitance, dielectric layers sandwiched with the inner electrode layers, and a pair of outer electrodes coupled to their associated inner electrode layers for output of the capacitance. The inner electrode layers are made of Ni. The dielectric layers are made of a dielectric ceramic composition having a structural formula of:{Bam(Til-xZrx)O2+m}1-.alpha.-.beta.-{MnO2}.alpha.-{X}.beta.where X is at least one of Yb2O3, Dy2O3, and ThO2 and m, x, .alpha., and .beta. are expressed as:0.98.ltoreq.m.ltoreq.1.020.ltoreq.x.ltoreq.0.20.005.ltoreq..alpha..ltoreq.0.050.001.ltoreq..beta..ltoreq.0.02so that the laminated ceramic capacitor can be minimized in the size, increased in the capacitance, and reduced in the cost of production.

    摘要翻译： 层叠陶瓷电容器包括用于显影电容的多个内部电极层，夹在内部电极层的电介质层和耦合到其相关联的内部电极层的一对外部电极，用于输出电容。 内部电极层由Ni制成。 电介质层由结构式为：{Bam（Til-xZrx）O 2 + m} 1-α-β - {MnO 2}α - {X}β的电介质陶瓷组合物制成，其中X是Yb 2 O 3中的至少一种 ，Dy 2 O 3和ThO 2，m，x，α和β表示为：0.98