发明授权
US5554765A Bisimide compounds, polyimide resin composition prepared therefrom, and
carbon fiber-reinforced polyimide resin composition
失效
双酰亚胺化合物，由其制备的聚酰亚胺树脂组合物和碳纤维增强的聚酰亚胺树脂组合物
- 专利标题： Bisimide compounds, polyimide resin composition prepared therefrom, and carbon fiber-reinforced polyimide resin composition
- 专利标题（中）： 双酰亚胺化合物，由其制备的聚酰亚胺树脂组合物和碳纤维增强的聚酰亚胺树脂组合物
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申请号： US478867申请日： 1995-06-07
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公开(公告)号： US5554765A公开(公告)日： 1996-09-10
- 发明人: Masahiro Ohta , Akio Matsuyama , Eiji Senoue , Fumiaki Kuwano , Osamu Yasui , Yasunori Yoshida , Akinori Ryu , Tadashi Kobayashi
- 申请人： Masahiro Ohta , Akio Matsuyama , Eiji Senoue , Fumiaki Kuwano , Osamu Yasui , Yasunori Yoshida , Akinori Ryu , Tadashi Kobayashi
- 申请人地址： JPX Tokyo
- 专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人： Mitsui Toatsu Chemicals, Inc.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX3-04963 19910121; JPX3-24303 19910219; JPX3-25932 19910220; JPX3-61685 19910326; JPX3-86558 19910418; JPX3-156792 19910627; JPX3-160211 19910701; JPX3-218286 19910829; JPX3-231295 19910911; JPX3-231296 19910911; JPX3-282849 19911029; JPX3-287660 19911101; JPX3-287661 19911101; WOXPCT/JP92/0039 19920120
- 主分类号： C07D209/48
- IPC分类号： C07D209/48 ; C07D209/66 ; C07D487/04 ; C08G73/10 ; C08G73/12 ; C08K5/3417 ; C08K9/04 ; C08L79/08 ; C09D179/08
摘要：
A moldable polyimide resin composition which has melt-flowability and excellent processability in addition to essential heat-resistant of polyimide and comprises an aromatic bisimide compound and polyimide resin. A further aspect relates to a carbon fiber reinforced polyimide resin composition which has excellent mechanical strengths and comprises a carbon fiber coated with aromatic bisimide compound on the surface and the polyimide resin. A still further aspect relates to a novel bisimide compound which is very useful as the aromatic bisimide compound in the composition.
公开/授权文献
- US3944182A Apparatus for manufacturing high-frequency coil devices 公开/授权日：1976-03-16
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