A method is proposed for controlling a reactive sputtering process wherein the working point on the physical characteristic curves, cathode voltage or working current intensity over reactive gas flow to the sputtering apparatus, defined by the value of one of the two factors determining the electrical power drain of the reactive sputtering process, is adjusted and maintained constant by metering the reactive gas, for example O.sub.2, to the process chamber. Further, the invention proposes a device for the practice of the method, wherein a sputtering apparatus is provided, comprising a controller 5 (reactive gas controller) and a control valve 8 for metering the reactive gas. Further, a signal line 15 is provided which carries the cathode voltage to the input of the controller in which the output of the controller is connected to the control valve via a line 16 which supplies the adjusting magnitude computed in the controller to the control valve.