发明授权
- 专利标题: Method of fabricating a self-aligned double recess gate profile
- 专利标题(中): 制造自对准双凹槽浇口型材的方法
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申请号: US453676申请日: 1995-05-30
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公开(公告)号: US5556797A公开(公告)日: 1996-09-17
- 发明人: Tom Y. Chi , Liping D. Hou , Kusol Lee , Danny Li , Ishver K. Naik , Tom Quach
- 申请人: Tom Y. Chi , Liping D. Hou , Kusol Lee , Danny Li , Ishver K. Naik , Tom Quach
- 申请人地址: CA Los Angeles
- 专利权人: Hughes Aircraft Company
- 当前专利权人: Hughes Aircraft Company
- 当前专利权人地址: CA Los Angeles
- 主分类号: H01L21/338
- IPC分类号: H01L21/338 ; H01L29/812 ; H01L21/8258
摘要:
A method of fabricating a self-aligned double gate recess profile in a semiconductor substrate is disclosed in which a first mask layer is formed over the substrate. A second mask layer having an opening is formed over the first mask layer. An opening at least as wide as the second mask layer's opening is formed through the first mask layer to expose the substrate beneath the second mask layer's opening. A first recess is etched in the semiconductor through the second mask layer's opening. The first mask layer's opening is then uniformly expanded and a wider recess, aligned to the first recess, is then formed in the semiconductor. The method is particularly applicable to the formation of self-aligned gate and channel recesses in a GaAs MESFET.
公开/授权文献
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