Invention Grant
- Patent Title: Overmolded semiconductor package
- Patent Title (中): 包覆半导体封装
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Application No.: US429605Application Date: 1995-04-27
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Publication No.: US5557150APublication Date: 1996-09-17
- Inventor: Patrick Variot , Chok J. Chia
- Applicant: Patrick Variot , Chok J. Chia
- Applicant Address: CA Milpitas
- Assignee: LSI Logic Corporation
- Current Assignee: LSI Logic Corporation
- Current Assignee Address: CA Milpitas
- Main IPC: G03F7/20
- IPC: G03F7/20 ; H01L23/31 ; H01L23/495 ; H01L23/498 ; H01L23/544 ; H01L29/06 ; H01L23/28
Abstract:
A technique for providing partially and fully overmolded semiconductor packages is described which prevents delamination (detachment) of the molding compound from the substrate by allowing the molding compound to flow through holes in the substrate and forming it into rivet-like anchors on the opposite side of the substrate. Various shapes of rivet-like anchors are described. Different embodiments provide for the formation of molded standoffs and locating pins integral to the anchor structures.
Public/Granted literature
- US3971482A Anti-leak closure valve Public/Granted day:1976-07-27
Information query
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