Invention Grant
US5557150A Overmolded semiconductor package 失效
包覆半导体封装

Overmolded semiconductor package
Abstract:
A technique for providing partially and fully overmolded semiconductor packages is described which prevents delamination (detachment) of the molding compound from the substrate by allowing the molding compound to flow through holes in the substrate and forming it into rivet-like anchors on the opposite side of the substrate. Various shapes of rivet-like anchors are described. Different embodiments provide for the formation of molded standoffs and locating pins integral to the anchor structures.
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