A multi-connector assembly for use with a printed circuit board having a conductive pattern comprises a plurality of electrical connectors to be mounted on the printed circuit board in a predetermined positional relationship with one another. Each connector comprises an insulator block having a fitting member to be fitted in a mating connector, and a plurality of electrical contacts fixedly supported in the insulator block. Each contact has a contacting portion to be brought into contact with a corresponding contact of the mating connector and a terminal portion to be mechanically and electrically connected to the conductive pattern. Each of a plurality of connecting bar members is for mechanically connecting the connectors adjacent to one another in the predetermined positional relationship to thereby maintain the connectors in the predetermined positional relationship. A common holding member is removably connected in common to the connecting bar members and has a handle portion to be chucked by a chucking member of a conveying machine for conveying the assembly.