发明授权
- 专利标题: Hybrid integrated circuit
- 专利标题(中): 混合集成电路
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申请号: US218604申请日: 1994-03-25
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公开(公告)号: US5559374A公开(公告)日: 1996-09-24
- 发明人: Susumu Ohta , Katsumi Ohkawa , Noriaki Sakamoto
- 申请人: Susumu Ohta , Katsumi Ohkawa , Noriaki Sakamoto
- 申请人地址: JPX Osaka
- 专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人: Sanyo Electric Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX5-066741 19930325; JPX5-074215 19930331; JPX5-074217 19930331
- 主分类号: H01L23/13
- IPC分类号: H01L23/13 ; H01L25/07 ; H01L23/48 ; H01L23/34
摘要:
A hybrid integrated circuit includes a plurality of metal plates supporting circuit elements and connectable directly to external power/output lines. The direct connection eliminates the need for solder terminals, allowing for reduced size and cost with increased reliability and lifespan. The metal plates can be position to allow for further minimization of the device, and uniform connection of internal wiring to the circuit elements.
公开/授权文献
- US4330522A Acid gas separation 公开/授权日:1982-05-18