发明授权
- 专利标题: Method and apparatus for thermographically and quantitatively analyzing a structure for disbonds and/or inclusions
- 专利标题(中): 热分析和定量分析脱粘和/或夹杂物结构的方法和装置
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申请号: US571688申请日: 1995-12-13
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公开(公告)号: US5562345A公开(公告)日: 1996-10-08
- 发明人: Joseph S. Heyman , William P. Winfree , K. Elliott Cramer , Joseph N. Zalamedia
- 申请人: Joseph S. Heyman , William P. Winfree , K. Elliott Cramer , Joseph N. Zalamedia
- 申请人地址: DC Washington
- 专利权人: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- 当前专利权人: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
- 当前专利权人地址: DC Washington
- 主分类号: G01N25/72
- IPC分类号: G01N25/72
摘要:
A heat source such as a magnetic induction/eddy current generator remotely heats a region of a surface of a test structure to a desired depth. For example, the frequency of the heating source can be varied to heat to the desired depth. A thermal sensor senses temperature changes in the heated region as a function of time. A computer compares these sensed temperature changes with calibration standards of a similar sample having known disbond and/or inclusion geography(ies) to analyze the test structure. A plurality of sensors can be arranged linearly to sense vector heat flow.
公开/授权文献
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