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US5562345A Method and apparatus for thermographically and quantitatively analyzing a structure for disbonds and/or inclusions 失效
热分析和定量分析脱粘和/或夹杂物结构的方法和装置

Method and apparatus for thermographically and quantitatively analyzing
a structure for disbonds and/or inclusions
摘要:
A heat source such as a magnetic induction/eddy current generator remotely heats a region of a surface of a test structure to a desired depth. For example, the frequency of the heating source can be varied to heat to the desired depth. A thermal sensor senses temperature changes in the heated region as a function of time. A computer compares these sensed temperature changes with calibration standards of a similar sample having known disbond and/or inclusion geography(ies) to analyze the test structure. A plurality of sensors can be arranged linearly to sense vector heat flow.
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