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US5576517A Low Dielectric constant materials for high speed electronics 失效
低介电常数材料用于高速电子

Low Dielectric constant materials for high speed electronics
摘要:
An electronic structure includes a circuit chip having chip pads and supported by a substrate, and a low dielectric constant porous polymer layer having pores and situated over the substrate and circuit chip. The porous polymer layer has at least one via therein aligned with at least one of the chip pads, and a pattern of electrical conductors extends over a portion of the porous polymer layer and into the at least one via. The pattern of electrical conductors does not significantly protrude into the pores of the porous polymer layer.
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