发明授权
- 专利标题: Method for fabricating a semiconductor device
- 专利标题(中): 半导体器件的制造方法
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申请号: US249197申请日: 1994-05-26
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公开(公告)号: US5585305A公开(公告)日: 1996-12-17
- 发明人: Masato Yamada , Takao Takenaka
- 申请人: Masato Yamada , Takao Takenaka
- 申请人地址: JPX Tokyo
- 专利权人: Shin-Etsu Handotai Co. Ltd.
- 当前专利权人: Shin-Etsu Handotai Co. Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX3-244832 19910829
- 主分类号: H01L21/22
- IPC分类号: H01L21/22 ; H01L21/223 ; H01L33/00 ; H01L33/30
摘要:
A method for fabricating a semiconductor device includes the steps of growing a second semiconductor layer on a first semiconductor layer which is highly doped with an impurity such as Zn and diffusing the impurity concurrently with the growing step of the second semiconductor layer from the first semiconductor layer as an impurity source to the second semiconductor layer to have a predetermined carrier concentration profile, by controlling both the diffusing speed of said impurity and the growing speed of said second semiconductor layer by changing the temperature in accordance with a predetermined sequence to have a predetermined carrier concentration profile in the second semiconductor layer.
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