发明授权
- 专利标题： Low stress ball grid array package
- 专利标题（中）： 低应力球栅阵列封装
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申请号： US403164申请日： 1995-03-13
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公开(公告)号： US5586010A公开(公告)日： 1996-12-17
- 发明人: Masood Murtuza , Abbas I. Attarwala
- 申请人： Masood Murtuza , Abbas I. Attarwala
- 申请人地址： TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： TX Dallas
- 主分类号： H01L23/13
- IPC分类号： H01L23/13 ; H01L23/367 ; H01L23/373 ; H05K1/11 ; H01R9/09 ; H05K1/14
摘要：
The ball grid array package (10) uses a flexible base (30) having a substantially flat center plate (34) disposed at a first level coupled to a substantially flat base plate (32) disposed at a second level. The center plate (34) is coupled to the base plate (32) by a plurality of flexible narrow straps (36-38) arranged substantially surrounding the center plate (34). The flexible base (30) accommodates the thermal expansion in the pedestal (18) caused by the powered up integrated circuit (16) so that the rest of the package does not expand and induce stress in the solder joint between the ball grid array (12) and the printed circuit board (14).
公开/授权文献
- US4953370A Handicraft for producing simulated needlepoint 公开/授权日：1990-09-04
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