发明授权
US5589223A Process for producing cermet cutting tools having both longitudinal and
granular crystal structures
失效
具有纵向和粒状晶体结构的金属陶瓷切割工具的制造方法
- 专利标题: Process for producing cermet cutting tools having both longitudinal and granular crystal structures
- 专利标题(中): 具有纵向和粒状晶体结构的金属陶瓷切割工具的制造方法
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申请号: US408691申请日: 1995-03-21
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公开(公告)号: US5589223A公开(公告)日: 1996-12-31
- 发明人: Niro Odani , Hironori Yoshimura , Akira Osada , Tetsuya Tanaka , Seiichirou Nakamura
- 申请人: Niro Odani , Hironori Yoshimura , Akira Osada , Tetsuya Tanaka , Seiichirou Nakamura
- 申请人地址: JPX Tokyo
- 专利权人: Mitsubishi Material Corp.
- 当前专利权人: Mitsubishi Material Corp.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX2-21048 19900131; JPX4-227874 19920804; JPX4-235265 19920811; JPX4-235266 19920811; JPX4-235267 19920811
- 主分类号: C23C16/36
- IPC分类号: C23C16/36 ; C23C30/00 ; C23C16/30
摘要:
A cermet cutting tool, and process for producing the same, comprising a substrate formed from titanium carbo-nitride based cermet, and a hard coating layer of average thickness 0.5.about.20 .mu.m, formed onto the surface of the cermet substrate comprising a lower layer formed from at least one layer of a compound selected from the group consisting of titanium carbide (TiC), titanium nitride (TiN), titanium carbo-nitride (TiCN), titanium carbo-oxide (TiCO) and titanium carbo-oxi-nitride (TiCNO), and aluminum oxide (Al.sub.2 O.sub.3). Additionally, at least one of the layers comprising the hard coating layer is a titanium carbo-nitride layer, and at least one layer of this titanium carbo-nitride layer comprises a longitudinal growth crystal structure, and a further layer comprises a granular crystal structure. In the method of fabrication, chemical vapor deposition is performed using a reaction gas composed of 1.about.5% of TiCl.sub.4, 0.1.about.1% of CH.sub.3 CN, 0.about.25% of N.sub.2 with the remaining portion being composed of H.sub.2, under a reaction temperature of 800.degree..about.900.degree. C. and a reaction pressure of 30.about.200 Torr.
公开/授权文献
- US6161303A Pressing apparatus having chamber end sealing 公开/授权日:2000-12-19
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