发明授权
US5589701A Process for realizing P-channel MOS transistors having a low threshold voltage in semiconductor integrated circuits for analog applications 失效
用于实现用于模拟应用的半导体集成电路中具有低阈值电压的P沟道MOS晶体管的工艺

  • 专利标题: Process for realizing P-channel MOS transistors having a low threshold voltage in semiconductor integrated circuits for analog applications
  • 专利标题(中): 用于实现用于模拟应用的半导体集成电路中具有低阈值电压的P沟道MOS晶体管的工艺
  • 申请号: US486747
    申请日: 1995-06-07
  • 公开(公告)号: US5589701A
    公开(公告)日: 1996-12-31
  • 发明人: Livio Baldi
  • 申请人: Livio Baldi
  • 申请人地址: ITX Agrate Brianza
  • 专利权人: SGS-Thomson Microelectronics S.r.1.
  • 当前专利权人: SGS-Thomson Microelectronics S.r.1.
  • 当前专利权人地址: ITX Agrate Brianza
  • 主分类号: H01L21/8238
  • IPC分类号: H01L21/8238 H01L29/76
Process for realizing P-channel MOS transistors having a low threshold
voltage in semiconductor integrated circuits for analog applications
摘要:
A process for forming low threshold voltage P-channel MOS transistors in semiconductor integrated circuits for analog applications, said circuits including high resistivity resistors formed in a layer of polycrystalline silicon and N-channel MOS transistors having active areas which have been obtained by implantation in a P-type well, comprises the steps of,providing a first mask over both said resistors and the semiconductor regions where the low threshold voltage P-channel transistors are to be formed,doping the polycrystalline layer uncovered by said first mask,providing a second mask for protecting the resistors and the semiconductor regions where said low threshold voltage P-channel transistors are to be formed, andN+ implanting the active areas of the N-channel transistors.
公开/授权文献
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70 .由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理;集成电路器件或其特殊部件的制造(由预制电组件组成的组装件的制造入H05K3/00,H05K13/00)
H01L21/77 ..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理(电可编程只读存储器或其多步骤的制造方法入H01L27/115)
H01L21/78 ...把衬底连续地分成多个独立的器件(改变表面物理特性或者半导体形状的切割入H01L21/304)
H01L21/82 ....制造器件,例如每一个由许多元件组成的集成电路
H01L21/822 .....衬底是采用硅工艺的半导体的(H01L21/8258优先)
H01L21/8232 ......场效应工艺
H01L21/8234 .......MIS工艺
H01L21/8238 ........互补场效应晶体管,例如CMOS
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