A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. This support has at least one fluid inlet connectable to a source of fluid at a higher pressure, at least one fluid outlet connectable to a fluid drain at a lower pressure, and at least one bearing surface over which fluid flows from the source to the drain. The polishing pad is supported by the fluid over the bearing surface for low-friction movement with respect to the support. Similar fluid bearings can be used in the wafer holder. An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder.