发明授权
- 专利标题： Process for preparing a multi-layer wiring board
- 专利标题（中）： 制备多层布线板的工艺
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申请号： US316376申请日： 1994-09-30
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公开(公告)号： US5593526A公开(公告)日： 1997-01-14
- 发明人: Kishio Yokouchi , Hiroshi Kamezaki , Masato Wakamura , Nobuo Kamehara , Koichi Niwa
- 申请人： Kishio Yokouchi , Hiroshi Kamezaki , Masato Wakamura , Nobuo Kamehara , Koichi Niwa
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX2-252500 19900920
- 主分类号： C04B38/08
- IPC分类号： C04B38/08 ; C04B35/16 ; H01L23/15 ; H05K1/03 ; H05K3/46 ; C04B37/00
摘要：
A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.
公开/授权文献
- US4954554A Silicone emulsions 公开/授权日：1990-09-04
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