公开(公告)号：US06560435B1

公开(公告)日：2003-05-06

申请号：US09937855

申请日：2001-09-28

申请人： Masashi Yamamoto ,  Koichi Niwa ,  Tetsuo Ishikawa ,  Shinichi Hosaka ,  Masahiro Nakano ,  Masahiko Saito ,  Toru Miyasaka

发明人： Masashi Yamamoto ,  Koichi Niwa ,  Tetsuo Ishikawa ,  Shinichi Hosaka ,  Masahiro Nakano ,  Masahiko Saito ,  Toru Miyasaka

IPC分类号： G03G1501

CPC分类号： G03G15/162 ,  G03G2215/0119

摘要： An intermediate transfer element has at least one or more elastic layers and a toner releasing layer provided on the surface of the elastic layer and has a surface shape including minute projections up to 60 &mgr;m and at least 20 &mgr;m high. By providing the intermediate transfer element with such projections, easy separation with respect to a poorly separable recording medium, such as thin paper is achieved, and an image free from image defects, such as white speckles.

摘要翻译： 中间转印元件具有至少一个或多个弹性层和设置在弹性层的表面上的调色剂释放层，并且具有包括高达60μm的微小突起和至少20μm的高的突起的表面形状。 通过为中间转印元件提供这样的突起，实现了相对于诸如薄纸等不良分离记录介质的容易分离，并且没有诸如白色斑点的图像缺陷的图像。

公开(公告)号：US5585332A

公开(公告)日：1996-12-17

申请号：US378087

申请日：1995-01-25

申请人： Atsushi Tanaka ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Atsushi Tanaka ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： B32B18/00 ,  C04B35/45 ,  H01L39/24 ,  B05D5/12

CPC分类号： C04B35/45 ,  H01L39/2422 ,  Y10S505/731 ,  Y10S505/732 ,  Y10S505/742

摘要： A perovskite type superconductor film having a high content, almost a single phase, of the high Tc phase is formed by the steps of: depositing at least one first film of a first material (e.g., a composite oxide of Bi-Sr-Ca-Cu-O system or Tl-Ba-Ca-Cu-O system) constituting a perovskite type superconductor over a substrate; depositing at least one second film of a second material containing an oxide or element (Bi.sub.2 O.sub.3, Tl.sub.2 O.sub.3, PbO.sub.x, etc., particularly PbO.sub.x) having a vapor pressure of more than 10.sup.-4 Pa at 800.degree. C. at least as a main component over the substrate; to thereby form a stack of the first and second films; and heat treating the stack of the first and second films to form the perovskite type superconductor film on the substrate. Further, preferred compositions of the as-deposited films or stack are determined.

摘要翻译： 通过以下步骤形成具有高含量，几乎单相的高Tc相的钙钛矿型超导体膜：沉积至少一种第一材料的第一膜（例如，Bi-Sr-Ca- Cu-O系或Tl-Ba-Ca-Cu-O系），在基板上构成钙钛矿型超导体; 在800℃下至少沉积至少具有蒸气压大于10-4Pa的氧化物或元素（Bi 2 O 3，Tl 2 O 3，PbO x等，特别是PbO x）的第二材料的至少一个第二膜至少作为主要成分 基材; 从而形成第一和第二膜的堆叠; 并对第一和第二膜的堆叠进行热处理，以在基板上形成钙钛矿型超导膜。 此外，确定沉积膜或叠层的优选组成。

公开(公告)号：US5349499A

公开(公告)日：1994-09-20

申请号：US53452

申请日：1993-04-28

申请人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Mitsutaka Yamada ,  Kishio Yokouchi ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01L23/427 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01L2924/0002

摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.

摘要翻译： 公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。 冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。

公开(公告)号：US5312803A

公开(公告)日：1994-05-17

申请号：US861823

申请日：1992-06-16

申请人： Atsushi Tanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Atsushi Tanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01L39/24 ,  B05D5/12

CPC分类号： H01L39/2464 ,  Y10S505/704 ,  Y10S505/73 ,  Y10S505/731 ,  Y10S505/732 ,  Y10S505/741 ,  Y10S505/742

摘要： In an oxide superconducting film wiring, when the line width is reduced, the evaporation of a component during firing becomes so vigorous that it becomes impossible to form a desired single crystal phase, which causes a significant lowering in the properties of the oxide superconducting wiring. This problem can be solved by preventing the evaporation of the evaporable component during the firing. Examples of this include a process wherein plate is placed above the superconductor forming material film wiring pattern on the substrate so as to face each other, the plate comprising a material having no chemical influence on the superconducting wiring, and a pattern of a material containing an evaporable component is arbitrarily formed, a process wherein a pattern having a smaller line width is sandwiched between patterns having a larger line width, and a process wherein the firing atmosphere or the concentration of the evaporable component in the pattern is varied depending upon the line width.

摘要翻译： PCT No.PCT / JP91 / 01422 Sec。 371日期：1992年6月16日 102（e）日期1992年6月16日PCT 1991年10月17日PCT公布。 第WO92 / 07381号公报 日期：1992年04月30日。在氧化物超导膜布线中，当线宽减小时，焙烧期间的成分的蒸发变得如此剧烈，不可能形成期望的单晶相，这导致了 氧化物超导布线的性能。 这个问题可以通过防止在焙烧期间的蒸发组分的蒸发来解决。 其实例包括其中板被放置在基板上的超导体形成材料膜布线图案之上以彼此面对的方法，该板包括对超导布线不具有化学影响的材料，以及含有 可以任意地形成蒸发部件，其中具有较小线宽的图形被夹在具有较大线宽的图案之间的处理，以及其中烧制气氛或图案中的可蒸发部件的浓度根据线宽变化的处理 。

公开(公告)号：US5015314A

公开(公告)日：1991-05-14

申请号：US469739

申请日：1990-01-19

申请人： Hitoshi Suzuki ,  Hiromitsu Yokoyama ,  Mineharu Tsukada ,  Hiromi Ogawa ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Hitoshi Suzuki ,  Hiromitsu Yokoyama ,  Mineharu Tsukada ,  Hiromi Ogawa ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H05K3/12 ,  H01B1/16 ,  H05K1/09 ,  H05K3/46

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A method for producing a ceramic circuit board comprising the steps of (i) forming a conductor portion of the ceramic circuit board by printing a conductive paste composition on a ceramic base plate for the circuit board and then (ii) firing the ceramic base plate and the conductive paste composition together, wherein a copper-base composition comprising a copper powder and 0.5 to 5 parts by weight, based on 100 parts by weight of copper powder, of at least one organo metallic compound capable of forming an inorganic compound or compounds, respectively, when fired in an inert atmosphere, is used as the conductive paste composition.The combined use of isopropyl tridodecylbenzene sulfonyl titanate and isopropyl triisostearoyl titanate greatly improve the flowability of the copper-base conductive paste composition.

公开(公告)号：US4642148A

公开(公告)日：1987-02-10

申请号：US738658

申请日：1985-05-28

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B31/06

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

摘要翻译： 一种制造多层陶瓷电路板的方法，包括以下步骤：形成由铜基糊料和玻璃 - 陶瓷层的图案组成的多层结构，所述玻璃陶瓷层由10％至75％重量的α - 氧化铝，20％至60％重量的可结晶或不可结晶的玻璃，其可以在低于铜的熔点的温度下烧结，以及5％至70％重量的石英玻璃，基于玻璃的总重量 - 陶瓷，与含有可热解聚树脂的粘合剂共混; 在除去热可解聚树脂的温度下，在分压为0.005〜0.3个大气压的含有水蒸气的惰性气氛中预热多层结构体; 在低于铜熔点的温度下，在不含水蒸气的惰性气氛中烧成多层结构，烧结玻璃陶瓷。

公开(公告)号：US4237606A

公开(公告)日：1980-12-09

申请号：US933073

申请日：1978-08-11

申请人： Koichi Niwa ,  Teruo Murase ,  Masatoshi Fujimori ,  Kyohei Murakawa

发明人： Koichi Niwa ,  Teruo Murase ,  Masatoshi Fujimori ,  Kyohei Murakawa

IPC分类号： B32B18/00 ,  H01L23/13 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/00 ,  H05K3/46 ,  H05K3/36

CPC分类号： H05K3/4605 ,  H01L23/13 ,  H01L23/49827 ,  H01L23/49838 ,  H05K3/4667 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/183 ,  H05K2201/0175 ,  H05K2201/0317 ,  H05K2203/061 ,  H05K3/002 ,  H05K3/0029 ,  H05K3/4611 ,  H05K3/4688 ,  H05K3/4697 ,  Y10T29/49126

摘要： In a method of manufacture of a multilayer ceramic board, a conductor land is formed and baked on a first substrate. A second substrate on which the wiring pattern is formed is then electrically connected to the first substrate via the land. An error in the substrate due to shrinkage at the time of sintering is thereby compensated by the conductor land. This assures the formation of a highly accurate wiring pattern on the sintered substrate surface, despite shrinkage of the ceramic during sintering of the raw sheets of ceramic.

摘要翻译： 在制造多层陶瓷板的方法中，在第一基板上形成导体焊盘并烘烤。 其上形成有布线图案的第二基板然后经由焊盘电连接到第一基板。 由于烧结时的收缩导致的基板的误差由导体接地补偿。 这确保了在烧结的基材表面上形成高度精确的布线图案，尽管在陶瓷的原始片材的烧结期间陶瓷的收缩。

公开(公告)号：US5443786A

公开(公告)日：1995-08-22

申请号：US700163

申请日：1991-12-17

申请人： Hiromitsu Yokoyama ,  Koji Omote ,  Hitoshi Suzuki ,  Mineharu Tsukada ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Hiromitsu Yokoyama ,  Koji Omote ,  Hitoshi Suzuki ,  Mineharu Tsukada ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01B1/02 ,  H01L21/48 ,  H01L23/498 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  B22F7/00 ,  H01B1/04

CPC分类号： H05K3/4061 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01L21/486 ,  H01L23/49866 ,  H01L23/49883 ,  H05K1/092 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K2203/121 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49165

摘要： A composition for the formation of vias on a ceramic substrate, the composition including (a) at least one powder containing copper, gold, silver, tungsten, molybdenum, nickel, palladium, platinum, aluminium, or an alloy thereof; and (b) 5 to 40 wt %, based on the weight of the powder in the composition, of one or more of an organosilicic compound, an organoaluminium compound, an organozirconium compound, and an organomagnesium compound. A further embodiment of a composition for the formation of vias includes (a) and (b) above and, in addition, (c) a binder material including a cellulose derivative or a heat decomposable polymethamethyl acrylate binder, and (d) a high boiling point organic solvent. The invention also includes a method for use in the formation of vias on a substrate having perforating holes therein. Such a substrate could be a glass ceramic composite substrate, an alumina substrate, a magnesia substrate, a zirconia substrate, or green sheets thereof. The holes are filled and the substrate is calcinated with the composition.

摘要翻译： PCT No.PCT / JP90 / 01202 Sec。 371 1991年12月17日第 102（e）1991年12月17日PCT PCT 1990年9月19日PCT公布。 公开号WO91 / 04650 1991年4月4日。用于在陶瓷基材上形成通孔的组合物，所述组合物包含（a）至少一种含有铜，金，银，钨，钼，镍，钯，铂，铝或 合金; 和（b）基于组合物中粉末重量的5-40重量％的一种或多种有机硅化合物，有机铝化合物，有机锆化合物和有机镁化合物。 用于形成通孔的组合物的另一实施方案包括上述（a）和（b），另外，（c）包含纤维素衍生物或可热分解的聚甲基丙烯酸甲酯粘合剂的粘合剂材料，和（d）高沸点 有机溶剂。 本发明还包括用于在其中具有穿孔的基板上形成通孔的方法。 这样的基板可以是玻璃陶瓷复合基板，氧化铝基板，氧化镁基板，氧化锆基板或其生坯片。 填充孔，并用该组合物煅烧底物。

公开(公告)号：US5286713A

公开(公告)日：1994-02-15

申请号：US64668

申请日：1993-05-21

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： B32B18/00 ,  C04B35/45 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/24 ,  B05D3/02 ,  B05D5/12

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/6567 ,  C04B2235/6585 ,  C04B2237/066 ,  C04B2237/125 ,  C04B2237/34 ,  C04B2237/343 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/703 ,  Y10S505/741

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US4954480A

公开(公告)日：1990-09-04

申请号：US197583

申请日：1988-04-27

申请人： Yoshihiko Imanaka ,  Takato Machi ,  Kazunori Yamanaka ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Yoshihiko Imanaka ,  Takato Machi ,  Kazunori Yamanaka ,  Hiromitsu Yokoyama ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H05K3/46 ,  B32B18/00 ,  C04B35/45 ,  C04B35/634 ,  C04B35/636 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L23/538 ,  H01L39/24

CPC分类号： C04B35/63416 ,  B32B18/00 ,  C04B35/45 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B35/634 ,  C04B35/63424 ,  C04B35/6365 ,  C04B35/645 ,  H01L21/4857 ,  H01L21/76891 ,  H01L23/49888 ,  H01L23/5383 ,  H01L39/2429 ,  H01L39/2464 ,  C04B2235/6567 ,  C04B2235/663 ,  C04B2237/343 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/704 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A multi-layer superconducting circuit substrate, including insulating layers, and interconnection patterns of a superconductive ceramic material located between the insulating layers, the patterns of the superconductive ceramic material being connected via through-holes of the superconductive ceramic material, is provided. The patterns of the superconductive ceramic material are preferably encapsulated with a metal of gold, silver, platinum or an alloy thereof.