发明授权
US5600180A Sealing structure for bumps on a semiconductor integrated circuit chip
失效
半导体集成电路芯片上的凸块密封结构
- 专利标题： Sealing structure for bumps on a semiconductor integrated circuit chip
- 专利标题（中）： 半导体集成电路芯片上的凸块密封结构
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申请号： US505152申请日： 1995-07-21
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公开(公告)号： US5600180A公开(公告)日： 1997-02-04
- 发明人: Teruo Kusaka , Naoji Senba , Atsushi Nishizawa , Nobuaki Takahashi
- 申请人： Teruo Kusaka , Naoji Senba , Atsushi Nishizawa , Nobuaki Takahashi
- 申请人地址： JPX Tokyo
- 专利权人： NEC Corporation
- 当前专利权人： NEC Corporation
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-170612 19940722
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L21/60 ; H01L23/485 ; H01L23/48
摘要：
A sealing structure for bumps on a semiconductor integrated circuit chip to be bonded through the bumps onto a circuit board is provided wherein a plurality of pads are formed on the semiconductor integrated circuit chip. Each of the pads is formed with a bump thereon. A coating material is provided to coat at least surfaces of the above a plurality of bumps. The material is made of an insulation material having a hardness sufficiently small for showing, when bonding the chip onto the circuit board, a deformation thereby at least a top portion of each of the bumps is made contact with pads provided on the circuit board.
公开/授权文献
- US5034569A Multilayer interconnection circuit board 公开/授权日：1991-07-23
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