发明授权
- 专利标题： Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
- 专利标题（中）： 将电子部件焊接到印刷电路板的工艺和设备，以及通过焊接获得的电子部件和印刷电路板的组装
-
申请号： US327907申请日： 1994-10-24
-
公开(公告)号： US5607609A公开(公告)日： 1997-03-04
- 发明人: Seiki Sakuyama , Hiroki Uchida , Isao Watanabe
- 申请人： Seiki Sakuyama , Hiroki Uchida , Isao Watanabe
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Ltd.
- 当前专利权人： Fujitsu Ltd.
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX5-265281 19931025; JPX5-266690 19931026; JPX6-045798 19940316; JPX6-135926 19940617
- 主分类号： B23K1/005
- IPC分类号： B23K1/005 ; B23K1/08 ; B23K35/02 ; B23K35/36 ; H05B3/28 ; H05K3/34 ; F27B9/06 ; F27D11/02 ; H05B3/20
摘要：
In accordance with the present invention, there is provided a soldering process comprising the steps of: providing in a furnace first and second heaters each adapted to emit infrared energy; setting a printed circuit board, which has a solder paste and an electronic component thereon, in the furnace; heating the printed circuit board with the first heater; and heating the electronic component with the second heater;wherein the first and second heaters have different radiation spectra such that infrared energy irradiated by the first heater is more absorbed by the printed circuit board and less absorbed by the electronic component than that irradiated by the second heater. The present invention also provides a soldering apparatus for use in such soldering process.
公开/授权文献
信息查询
IPC分类:
