发明授权
- 专利标题: Sputtering apparatus
- 专利标题(中): 溅射装置
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申请号: US362778申请日: 1994-12-23
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公开(公告)号: US5609739A公开(公告)日: 1997-03-11
- 发明人: Isamu Aokura , Hitoshi Yamanishi , Youichi Ohnishi , Tanejiro Ikeda
- 申请人: Isamu Aokura , Hitoshi Yamanishi , Youichi Ohnishi , Tanejiro Ikeda
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX5-328513 19931224; JPX6-167801 19940720
- 主分类号: C23C14/35
- IPC分类号: C23C14/35 ; H01J37/34 ; C23C14/34
摘要:
A sputtering apparatus for performing sputtering operation by using a rectangular target made of ferromagnetic material, the apparatus includes an electrode in which one first permanent magnet is disposed on each side edge of a front surface of the target, polarities of the first magnets confronting each other with the target interposed between the first magnets are opposite to each other, one second permanent magnet is disposed on each side edge of a rear surface of the target, polarities of the second magnets confronting each other with the target interposed between the second magnets are opposite to each other, and the polarity of each second magnet disposed on the rear surface of the target is the same as that of the first magnet disposed on the front surface of the target.
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