发明授权
US5614443A Method of producing a frame made of connected semiconductor die mounting
substrates
失效
制造由连接的半导体管芯安装基板制成的框架的方法
- 专利标题： Method of producing a frame made of connected semiconductor die mounting substrates
- 专利标题（中）： 制造由连接的半导体管芯安装基板制成的框架的方法
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申请号： US622144申请日： 1996-03-27
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公开(公告)号： US5614443A公开(公告)日： 1997-03-25
- 发明人: Takashi Nakashima , Keiji Takai , Kouji Tateishi
- 申请人： Takashi Nakashima , Keiji Takai , Kouji Tateishi
- 申请人地址： JPX Kitakyushu
- 专利权人： Mitsui High-tec, Inc.
- 当前专利权人： Mitsui High-tec, Inc.
- 当前专利权人地址： JPX Kitakyushu
- 优先权： JPX7-196157 19950706
- 主分类号： H01L23/12
- IPC分类号： H01L23/12 ; H01L21/98 ; H01L23/50 ; H01L23/538 ; H01L25/065 ; H01L21/60
摘要：
Method of producing a frame made of connected semiconductor die mounting substrates comprises i) a first step for producing a metal substrate sheet wherein an original material for metal substrate sheet of a desired size is cut out from a metal material and an erosion preventing layer is provided on the entire surface thereof, ii) a second step for producing a circuit substrate sheet wherein the circuit substrate sheet is made of a resin substrate coated with a copper leaf layer and is provided with a lead pattern on the surface thereof in place, iii) a third step for producing a connected semiconductor die mounting substrate sheet by adhering the metal substrate sheet to the circuit substrate sheet, iv) a fourth step for forming a plurality of pilot apertures and slits on the connected semiconductor die mounting substrate sheet by press working and v) a fifth step for producing a plurality of connected semiconductor die mounting substrate frames by separating the connected semiconductor die mounting substrate sheet.
公开/授权文献
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