The present invention relates to a structure of semiconductor chip joint for mounting a plurality of semiconductor chips onto a single package. The joint comprises two or more semiconductor chips, the chips each having an element formation surface and a rear surface and being piled up with their element formation surfaces directed either in a first direction or in a second direction by turns so that their element formation surfaces are opposed to each other while their rear surfaces are opposed to each other, a bonding pad provided on the element formation surface of the chip directed in the first direction, connecting pad provided on the element formation surface of the chip directed both in the first direction and in the second direction;wherein the chip whose element formation surface is directed in the second direction is piled on so that the bonding pad of the chip whose element formation surface is directed in the first direction is exposed, and the chip whose element formation surface is directed in the first direction and the chip whose element formation surface is directed in the second direction are electrically connected to each other through their respective connecting pads with a conductive bump.