发明授权
- 专利标题： Light emitting diode display package
- 专利标题（中）： 发光二极管显示封装
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申请号： US599434申请日： 1996-01-18
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公开(公告)号： US5621225A公开(公告)日： 1997-04-15
- 发明人: Chan-Long Shieh , Hsing-Chung Lee , Paige M. Holm
- 申请人： Chan-Long Shieh , Hsing-Chung Lee , Paige M. Holm
- 申请人地址： IL Schaumburg
- 专利权人： Motorola
- 当前专利权人： Motorola
- 当前专利权人地址： IL Schaumburg
- 主分类号： H01L21/60
- IPC分类号： H01L21/60 ; G09F9/33 ; H01L25/16 ; H01L27/15 ; H01L33/00 ; H01L23/48
摘要：
A light emitting diode display package and method of fabricating a light emitting diode (LED) display package including a light emitting diode array on a substrate, having row and column connection pads routed to display connection pads positioned on an uppermost surface of the LED array device, a separate silicon driver device having connection pads routed to an uppermost surface, positioned to cooperatively meet those of the LED device when properly registered, the LED device flip chip bump bonded to the driver device using standard C5 DCA, an underfill layer positioned between the space defined by the LED device and the driver device. The LED display and driver device package subsequently having selectively removed the substrate onto which the LED array was initially formed. The light emitted from the LED display device, being emitted through the remaining indium-gallium-aluminum-phosphide (InGaAlP) epilayer of the LED device.
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