发明授权
US5627258A Binder for use in metal powder injection molding and debinding method by
the use of the same
失效
用于金属粉末注射成型和脱粘方法的粘合剂通过使用相同
- 专利标题： Binder for use in metal powder injection molding and debinding method by the use of the same
- 专利标题（中）： 用于金属粉末注射成型和脱粘方法的粘合剂通过使用相同
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申请号： US403199申请日： 1995-03-13
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公开(公告)号： US5627258A公开(公告)日： 1997-05-06
- 发明人: Takemori Takayama , Masato Miyake , Yoshitaka Ohyama , Katsuyoshi Saito , Hiroshi Ono
- 申请人： Takemori Takayama , Masato Miyake , Yoshitaka Ohyama , Katsuyoshi Saito , Hiroshi Ono
- 申请人地址： JPX Tokyo
- 专利权人： Kabushiki Kaisha Komatsu Seisakusho
- 当前专利权人： Kabushiki Kaisha Komatsu Seisakusho
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX6-042643 19940314
- 主分类号： B22F1/00
- IPC分类号： B22F1/00 ; B22F3/22 ; C08K3/08 ; C08K5/16 ; C08G73/10 ; C08K5/20 ; C08K5/3477
摘要：
By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding.From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.
公开/授权文献
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