发明授权
US5637185A Systems for performing chemical mechanical planarization and process for
conducting same
失效
用于执行化学机械平面化的系统和用于进行其的处理
- 专利标题： Systems for performing chemical mechanical planarization and process for conducting same
- 专利标题（中）： 用于执行化学机械平面化的系统和用于进行其的处理
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申请号： US413487申请日： 1995-03-30
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公开(公告)号： US5637185A公开(公告)日： 1997-06-10
- 发明人: Shyam P. Murarka , Ronald J. Gutmann , David J. Duquette , Joseph M. Steigerwald
- 申请人： Shyam P. Murarka , Ronald J. Gutmann , David J. Duquette , Joseph M. Steigerwald
- 申请人地址： NY Troy
- 专利权人： Rensselaer Polytechnic Institute
- 当前专利权人： Rensselaer Polytechnic Institute
- 当前专利权人地址： NY Troy
- 主分类号： B24B37/005
- IPC分类号： B24B37/005 ; B24B49/02 ; B24B1/00 ; B24B37/00
摘要：
A system for performing chemical mechanical planarization for a semiconductor wafer includes a chemical mechanical polishing system including a chemical mechanical polishing slurry. The system also includes a device for measuring the electrochemical potential of the slurry during processing which is electrically connected to the slurry, and a device for detecting the end point of the process, based upon the electrochemical potential of the slurry, which is responsive to the electrochemical potential measuring device. Accurate in situ control of a chemical mechanical polishing process is thereby provided.
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