发明授权
- 专利标题： Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two
- 专利标题（中）： 引线框半导体集成电路器件采用相同的方法和工艺制造两者
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申请号： US311021申请日： 1994-09-22
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公开(公告)号： US5637913A公开(公告)日： 1997-06-10
- 发明人: Yujiro Kajihara , Kazunari Suzuki , Kunihiro Tsubosaki , Hiromichi Suzuki , Yoshinori Miyaki , Takahiro Naito , Sueo Kawai
- 申请人： Yujiro Kajihara , Kazunari Suzuki , Kunihiro Tsubosaki , Hiromichi Suzuki , Yoshinori Miyaki , Takahiro Naito , Sueo Kawai
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi Microcomputer System, Ltd.
- 当前专利权人： Hitachi, Ltd.,Hitachi Microcomputer System, Ltd.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX4-071116 19920327; JPX4-320098 19921130
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L21/48 ; H01L21/52 ; H01L21/60 ; H01L23/495 ; H01L23/48
摘要：
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.
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