公开(公告)号：US5378656A

公开(公告)日：1995-01-03

申请号：US38684

申请日：1993-03-29

申请人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

发明人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/495

CPC分类号： H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121

摘要： In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

摘要翻译： 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：USRE43443E1

公开(公告)日：2012-06-05

申请号：US09987978

申请日：2001-11-16

申请人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

发明人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC分类号： H01L23/495

CPC分类号： H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2224/05599

摘要： In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

摘要翻译： 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：US5637913A

公开(公告)日：1997-06-10

申请号：US311021

申请日：1994-09-22

申请人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

发明人： Yujiro Kajihara ,  Kazunari Suzuki ,  Kunihiro Tsubosaki ,  Hiromichi Suzuki ,  Yoshinori Miyaki ,  Takahiro Naito ,  Sueo Kawai

IPC分类号： H01L23/50 ,  H01L21/48 ,  H01L21/52 ,  H01L21/60 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L24/743 ,  H01L21/4842 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/02166 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/82181 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/838 ,  H01L2224/85181 ,  H01L2224/859 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  Y10T29/49121

摘要： In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.

摘要翻译： 为了提高回流焊时的LSI封装的封装体抗开裂性，并且提供适用于制造根据柔性制造系统的LSI封装的引线框和使用引线框的LSI，半导体芯片2 并且通过使管芯焊盘3的外部尺寸小于要安装在其上的半导体芯片的外部尺寸来扩大树脂。 此外，通过根据半导体芯片2的外部尺寸将引线5的前端切割成合适的长度，可以将不同的外部尺寸的各种半导体芯片2安装在管芯焊盘3上。

公开(公告)号：US07247576B2

公开(公告)日：2007-07-24

申请号：US11260182

申请日：2005-10-28

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/302

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片

公开(公告)号：US20070298545A1

公开(公告)日：2007-12-27

申请号：US11780585

申请日：2007-07-20

申请人： Yoshinori MIYAKI ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori MIYAKI ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/58

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片

公开(公告)号：US06989334B2

公开(公告)日：2006-01-24

申请号：US10437916

申请日：2003-05-15

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/302

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片

公开(公告)号：US06943456B2

公开(公告)日：2005-09-13

申请号：US10777084

申请日：2004-02-13

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/56 ,  H01L23/495 ,  H01L23/48

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06179 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pad are sealed with a plastic mold. The semiconductor chip and the die pad are disposed within a cavity of a mold so that the clearance from the reverse surface of the die pad to the inside wall surface of the cavity opposite to the reverse surface of the die pad becomes narrower, by a length corresponding to the thickness of the die pad, than the clearance from the principal surface of the semiconductor chip to the inside wall surface of the cavity opposite to the principal surface of the semiconductor chip; and a resin is poured from a center gate into said cavity to form a plastic mold, which makes it possible to prevent said semiconductor chip from being lifted upwardly by the resin flowing in a filling region on the reverse surface side of the semiconductor chip. As a result, inconvenient shifting of the semiconductor chip, bonding wires and the like in the plastic mold can be prevented, leading to an increase in the yield of the plastic molded type semiconductor device.

摘要翻译： 提供了一种用于制造塑料模制型半导体器件的工艺，其中芯片焊盘形成为具有比要安装在管芯焊盘的主表面上的半导体芯片更小的面积，并且半导体芯片和管芯焊盘被密封 用塑料模具。 半导体芯片和芯片焊盘设置在模具的腔内，使得从芯片焊盘的反面到与模具垫的反面相反的腔的内壁表面的间隙变窄，长度 与半导体芯片的主表面到与半导体芯片的主表面相对的腔的内壁表面的间隙相对应于芯片焊盘的厚度; 并且将树脂从中心浇口注入所述空腔中以形成塑料模具，这使得可以防止所述半导体芯片被在半导体芯片的反面上的填充区域中流动的树脂向上提升。 结果，可以防止半导体芯片，接合线等在塑料模具中的不方便的移动，导致塑料模制型半导体器件的产量的增加。

公开(公告)号：US06692989B2

公开(公告)日：2004-02-17

申请号：US10371275

申请日：2003-02-24

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L2144

CPC分类号： H01L24/32 ,  H01L21/565 ,  H01L23/49503 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/06179 ,  H01L2224/29007 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/3512

摘要： A process is provided for the fabrication of a plastic molded type semiconductor device in which a die pad is formed to have a smaller area than a semiconductor chip to be mounted on a principal surface of the die pad and the semiconductor chip and die pad are sealed with a plastic mold. The semiconductor chip and the die pad are disposed within a cavity of a mold so that the clearance from the reverse surface of the die pad to the inside wall surface of the cavity opposite to the reverse surface of the die pad becomes narrower, by a length corresponding to the thickness of the die pad, than the clearance from the principal surface of the semiconductor chip to the inside wall surface of the cavity opposite to the principal surface of the semiconductor chip; and a resin is poured from a center gate into said cavity to form a plastic mold, which makes it possible to prevent said semiconductor chip from being lifted upwardly by the resin flowing in a filling region on the reverse surface side of the semiconductor chip. As a result, inconvenient shifting of the semiconductor chip, bonding wires and the like in the plastic mold can be prevented, leading to an increase in the yield of the plastic molded type semiconductor device.

摘要翻译： 提供了一种用于制造塑料模制型半导体器件的工艺，其中芯片焊盘形成为具有比要安装在管芯焊盘的主表面上的半导体芯片更小的面积，并且半导体芯片和管芯焊盘被密封 用塑料模具。 半导体芯片和芯片焊盘设置在模具的腔内，使得从芯片焊盘的反面到与模具垫的反面相反的腔的内壁表面的间隙变窄，长度 与半导体芯片的主表面到与半导体芯片的主表面相对的腔的内壁表面的间隙相对应于芯片焊盘的厚度; 并且将树脂从中心浇口注入所述空腔中以形成塑料模具，这使得可以防止所述半导体芯片被在半导体芯片的反面上的填充区域中流动的树脂向上提升。 结果，可以防止半导体芯片，接合线等在塑料模具中的不方便的移动，导致塑料模制型半导体器件的产量的增加。

公开(公告)号：US07678706B2

公开(公告)日：2010-03-16

申请号：US11780585

申请日：2007-07-20

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L21/302

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.

摘要翻译： 通过使引线框架的管芯焊盘的外观比安装在其上的半导体芯片的外观更小，从而抑制芯片焊盘背面附近的封装裂缝的发生，并且还发生封装裂纹 通过在最终钝化膜（最终钝化膜）上形成覆盖顶层导电布线的最终钝化膜（最终钝化膜）的与构成封装体的树脂具有良好粘附性的有机材料层来抑制半导体芯片附近的主表面。 半导体芯片

公开(公告)号：US20060049499A1

公开(公告)日：2006-03-09

申请号：US11260182

申请日：2005-10-28

申请人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

发明人： Yoshinori Miyaki ,  Hiromichi Suzuki ,  Kazunari Suzuki ,  Takafumi Nishita ,  Fujio Ito ,  Kunihiro Tsubosaki ,  Akihiko Kameoka ,  Kunihiko Nishi

IPC分类号： H01L23/02

CPC分类号： H01L24/27 ,  H01L21/56 ,  H01L23/3142 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/562 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/743 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/274 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/29339 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/743 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2224/85 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： The occurrence of a package crack in the back vicinity of a die pad is restrained by making the outward appearance of the die pad of a lead frame smaller than that of a semiconductor chip which is mounted on it, and also the occurrence of a package crack in the main surface vicinity of the semiconductor chip is restrained by forming a layer of organic material with good adhesion property with the resin that constitutes the package body on the final passivation film (final passivation film) that covers the top layer of conductive wirings of the semiconductor chip.