发明授权
- 专利标题： Mechanical interlocking of fillers and epoxy/resin
- 专利标题（中）： 填料和环氧/树脂的机械互锁
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申请号： US433101申请日： 1995-05-03
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公开(公告)号： US5644168A公开(公告)日： 1997-07-01
- 发明人: Jeremias P. Libres , Abbas I. Attarwala , Mario A. Bolanos , Jimmy Liang , Indran B. Nair
- 申请人： Jeremias P. Libres , Abbas I. Attarwala , Mario A. Bolanos , Jimmy Liang , Indran B. Nair
- 申请人地址： TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： TX Dallas
- 主分类号： H01L21/56
- IPC分类号： H01L21/56 ; H01L23/29 ; H01L23/31 ; H01L23/28
摘要：
A semiconductor package which comprises a lead frame, a semiconductor chip secured to the lead frame and a mold composition encasing the lead frame and the semiconductor chip has a filler of ceramic particles. Each of the ceramic particles, preferably silica or alumina, has macroscopic pores of sufficient size to receive a resin binder therein, the pores extending from the surface of the particle to the particle interior. A permanently hardenable composition adherable to the ceramic particles preferably an epoxy cresol novolac, extends around the ceramic particles and into the pores. The ceramic particles are formed by providing ceramic particles having a macroscopically smooth surface and subjecting the surfaces of the particles to a composition capable of removing portions of the particles, preferably hydrofluoric acid, while agitating the particles to form the pores.
公开/授权文献
- US4944695A Connector terminal retaining construction 公开/授权日：1990-07-31
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