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公开(公告)号：US5644168A
公开(公告)日：1997-07-01
申请号：US433101
申请日：1995-05-03
CPC分类号： H01L23/295 , H01L2924/0002
摘要： A semiconductor package which comprises a lead frame, a semiconductor chip secured to the lead frame and a mold composition encasing the lead frame and the semiconductor chip has a filler of ceramic particles. Each of the ceramic particles, preferably silica or alumina, has macroscopic pores of sufficient size to receive a resin binder therein, the pores extending from the surface of the particle to the particle interior. A permanently hardenable composition adherable to the ceramic particles preferably an epoxy cresol novolac, extends around the ceramic particles and into the pores. The ceramic particles are formed by providing ceramic particles having a macroscopically smooth surface and subjecting the surfaces of the particles to a composition capable of removing portions of the particles, preferably hydrofluoric acid, while agitating the particles to form the pores.
摘要翻译： 包括引线框架，固定到引线框架的半导体芯片和封装引线框架和半导体芯片的模具组合物的半导体封装具有陶瓷颗粒填料。 每个陶瓷颗粒，优选二氧化硅或氧化铝，具有足够尺寸的宏观孔，以在其中容纳树脂粘合剂，孔从颗粒表面延伸到颗粒内部。 可与陶瓷颗粒粘合的永久可硬化组合物优选环氧甲酚酚醛清漆，围绕陶瓷颗粒延伸到孔中。 陶瓷颗粒通过提供具有宏观光滑表面的陶瓷颗粒形成，并且使颗粒表面能够在搅拌颗粒以形成孔的同时除去颗粒的一部分，优选氢氟酸的组合物。
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公开(公告)号：US5586010A
公开(公告)日：1996-12-17
申请号：US403164
申请日：1995-03-13
申请人： Masood Murtuza , Abbas I. Attarwala
发明人： Masood Murtuza , Abbas I. Attarwala
IPC分类号： H01L23/13 , H01L23/367 , H01L23/373 , H05K1/11 , H01R9/09 , H05K1/14
CPC分类号： H01L23/13 , H01L23/3675 , H01L23/3736 , H01L2224/48091 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , Y10T29/49149
摘要： The ball grid array package (10) uses a flexible base (30) having a substantially flat center plate (34) disposed at a first level coupled to a substantially flat base plate (32) disposed at a second level. The center plate (34) is coupled to the base plate (32) by a plurality of flexible narrow straps (36-38) arranged substantially surrounding the center plate (34). The flexible base (30) accommodates the thermal expansion in the pedestal (18) caused by the powered up integrated circuit (16) so that the rest of the package does not expand and induce stress in the solder joint between the ball grid array (12) and the printed circuit board (14).
摘要翻译： 球栅阵列封装（10）使用具有基本上平坦的中心板（34）的柔性基座（30），所述基板平坦的中心板（34）设置在与设置在第二水平处的基本上平坦的基板（32）相连的第一平面处。 中心板（34）通过布置成基本围绕中心板（34）的多个柔性窄带（36-38）连接到基板（32）。 柔性基座（30）容纳由加电集成电路（16）引起的基座（18）中的热膨胀，使得封装的其余部分不膨胀并且在球栅阵列（12）之间的焊接接头中引起应力 ）和印刷电路板（14）。
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