发明授权
US5650357A Process for manufacturing a lead frame capacitor and
capacitively-coupled isolator circuit using same
失效
用于制造引线框电容器和使用其的电容耦合隔离电路的工艺
- 专利标题： Process for manufacturing a lead frame capacitor and capacitively-coupled isolator circuit using same
- 专利标题（中）： 用于制造引线框电容器和使用其的电容耦合隔离电路的工艺
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申请号： US401033申请日： 1995-03-08
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公开(公告)号： US5650357A公开(公告)日： 1997-07-22
- 发明人: Robert C. Dobkin , Robert L. Reay
- 申请人： Robert C. Dobkin , Robert L. Reay
- 申请人地址： CA Milpitas
- 专利权人： Linear Technology Corporation
- 当前专利权人： Linear Technology Corporation
- 当前专利权人地址： CA Milpitas
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L21/822 ; H01L23/495 ; H01L23/64 ; H01L25/00 ; H01L27/04 ; H05K1/16 ; H05K3/20 ; H01L21/56 ; H01L21/58 ; H01L21/60 ; H01L21/71
摘要：
A capacitor is provided including first and second electrodes formed from portions of the lead frame structure used in conventional integrated circuit packaging. The electrodes are encapsulated with dielectric molding material which provides dielectric insulation between the electrodes. A low power capacitively-coupled digital isolator circuit is also provided. The circuit employs a pair of the lead frame capacitors of the present invention and includes differential driver and receiver circuits. The receiver can also include an optional filter for increasing noise and glitch immunity.
公开/授权文献
- US5237508A Production control system 公开/授权日：1993-08-17