Thermoplastic molding materials containA) from 5 to 95% by weight of a semicrystalline, partly aromatic copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms, the molar percentages of the components a.sub.1) to a.sub.4) summing to 100%,B) from 5 to 95% by weight of a copolymer of vinylaromatic compounds with .alpha.,.beta.-unsaturated dicarboxylic anhydrides and .alpha.,.beta.-unsaturated dicarboximides,C) from 0 to 90% by weight of an SAN, ABS or ASA polymer or of a polymer of a C.sub.1 -C.sub.18 -alkyl ester of (meth)acrylic acid or of a mixture thereof,D) from 0 to 20% by weight of an elastomeric polymer,E) from 0 to 50% by weight of a fibrous or particulate filler andF) from 0 to 30% by weight of conventional additives and processing assistants,the percentages by weight of the components A) to F) summing to 100 %.