A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.