Invention Grant
- Patent Title: Electroplating apparatus
- Patent Title (中): 电镀设备
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Application No.: US603246Application Date: 1996-02-16
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Publication No.: US5660699APublication Date: 1997-08-26
- Inventor: Tadashi Saito , Atsushi Sato , Hisashi Misumi
- Applicant: Tadashi Saito , Atsushi Sato , Hisashi Misumi
- Applicant Address: JPX Tokyo
- Assignee: Kao Corporation
- Current Assignee: Kao Corporation
- Current Assignee Address: JPX Tokyo
- Priority: JPX7-031096 19950220; JPX7-132149 19950530; JPX7-139484 19950606
- Main IPC: C25D17/06
- IPC: C25D17/06
Abstract:
An electroplating apparatus has a cathode base for supporting a substrate, and a clamper for clamping a peripheral edge portion of the substrate against the cathode base. A plating solution is supplied onto the substrate so that the surface of the substrate is plated. A negative pressure source clamps the substrate by drawing the clamper under a negative pressure through a suction conduit.
Public/Granted literature
- US5144358A Automatic focusing camera Public/Granted day:1992-09-01
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