Invention Grant
- Patent Title: CPU dissipator mounting apparatus
- Patent Title (中): CPU散热器安装装置
-
Application No.: US537364Application Date: 1995-10-02
-
Publication No.: US5668348APublication Date: 1997-09-16
- Inventor: Chun-Sheng Lin
- Applicant: Chun-Sheng Lin
- Assignee: Lin; Chun-Sheng
- Current Assignee: Lin; Chun-Sheng
- Main IPC: H01L23/40
- IPC: H01L23/40 ; H05K7/10 ; H05K7/20
Abstract:
The present invention is to provide a dissipator mounting apparatus having a metal plate and a metal snap ring, where the two sides of the metal plate stretch upward and form an elastic tilt angle, and on one end of the metal plate bends downward and forms an opening to be firmly received in the barb of the ZIF socket, while the other end of the metal plate forms another hole for holding the snap ring whose rods stretch horizontally inward from the gap. Thus the CPU and the dissipator board can be tightly combined together with the help of the mounting apparatus.
Public/Granted literature
- US5048619A Down-hole bearing assemblies Public/Granted day:1991-09-17
Information query
IPC分类: