Diamond-like carbon for use in VLSI and ULSI interconnect systems

发明授权

US5674355A Diamond-like carbon for use in VLSI and ULSI interconnect systems 失效

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专利标题： Diamond-like carbon for use in VLSI and ULSI interconnect systems
申请号： US483682

申请日： 1995-06-07
公开(公告)号： US5674355A

公开(公告)日： 1997-10-07
发明人: Stephan Alan Cohen , Daniel Charles Edelstein , Alfred Grill , Jurij Rostyslav Paraszczak , Vishnubhai Vitthalbhai Patel
申请人： Stephan Alan Cohen , Daniel Charles Edelstein , Alfred Grill , Jurij Rostyslav Paraszczak , Vishnubhai Vitthalbhai Patel
申请人地址： NY Armonk
专利权人： International Business Machines Corp.
当前专利权人： International Business Machines Corp.
当前专利权人地址： NY Armonk
主分类号： H01L21/8238
IPC分类号： H01L21/8238 ; H01L21/314 ; H01L21/768 ; H01L23/522 ; H01L23/532 ; H01L27/092 ; H01L21/306

Diamond-like carbon for use in VLSI and ULSI interconnect systems

摘要：

The present invention relates to semiconductor devices comprising as one of their structural components diamond-like carbon as an insulator for spacing apart one or more levels of a conductor on an integrated circuit chip. The present invention also relates to a method for forming an integrated structure and to the integrated structure produced therefrom. The present invention further provides a method for selectively ion etching a diamond-like carbon layer from a substrate containing such a layer.

公开/授权文献

US5053257A Process for forming film of hydrolyzed ethylene-vinyl acetate copolymer 公开/授权日：1991-10-01

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/70	.由在一共用基片内或其上形成的多个固态组件或集成电路组成的器件或其部件的制造或处理；集成电路器件或其特殊部件的制造（由预制电组件组成的组装件的制造入H05K3/00，H05K13/00）
H01L21/77	..在公共衬底中或上面形成的由许多固态元件或集成电路组成的器件的制造或处理（电可编程只读存储器或其多步骤的制造方法入H01L27/115）
H01L21/78	...把衬底连续地分成多个独立的器件（改变表面物理特性或者半导体形状的切割入H01L21/304）
H01L21/82	....制造器件，例如每一个由许多元件组成的集成电路
H01L21/822	.....衬底是采用硅工艺的半导体的（H01L21/8258优先）
H01L21/8232	......场效应工艺
H01L21/8234	.......MIS工艺
H01L21/8238	........互补场效应晶体管，例如CMOS