发明授权
- 专利标题： Polishing apparatus
- 专利标题（中）： 抛光设备
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申请号： US590477申请日： 1996-01-24
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公开(公告)号： US5679063A公开(公告)日： 1997-10-21
- 发明人: Norio Kimura , You Ishii , Hozumi Yasuda , Koji Saito , Masako Watase , Shiro Mishima
- 申请人： Norio Kimura , You Ishii , Hozumi Yasuda , Koji Saito , Masako Watase , Shiro Mishima
- 申请人地址： JPX Tokyo JPX Kawasaki
- 专利权人： Ebara Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人： Ebara Corporation,Kabushiki Kaisha Toshiba
- 当前专利权人地址： JPX Tokyo JPX Kawasaki
- 优先权： JPX7-027630 19950124
- 主分类号： B24B37/00
- IPC分类号： B24B37/00 ; B24B57/02 ; B24B7/00
摘要：
A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.
公开/授权文献
- US4553471A Wheel cylinder assembly with proportioner 公开/授权日：1985-11-19
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