发明授权
- 专利标题： Process for producing multilayer printed circuit board
- 专利标题（中）： 多层印刷电路板生产工艺
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申请号： US576488申请日： 1995-12-21
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公开(公告)号： US5690837A公开(公告)日： 1997-11-25
- 发明人: Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
- 申请人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人： Hitachi Chemical Company, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX7-123575 19950523; JPX7-123576 19950523
- 主分类号： H05K3/00
- IPC分类号： H05K3/00 ; H05K3/02 ; H05K3/38 ; H05K3/46 ; B44C1/22 ; C23F1/00
摘要：
In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
公开/授权文献
- US5224509A Automatic faucet 公开/授权日：1993-07-06
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