发明授权
US5696013A Method of manufacturing semiconductor device having unit circuit-blocks
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制造具有单位电路块的半导体器件的方法
- 专利标题: Method of manufacturing semiconductor device having unit circuit-blocks
- 专利标题(中): 制造具有单位电路块的半导体器件的方法
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申请号: US463928申请日: 1995-06-05
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公开(公告)号: US5696013A公开(公告)日: 1997-12-09
- 发明人: Taiji Ema
- 申请人: Taiji Ema
- 申请人地址: JPX Kawasaki
- 专利权人: Fujitsu Limited
- 当前专利权人: Fujitsu Limited
- 当前专利权人地址: JPX Kawasaki
- 优先权: JPX3-51817 19910318
- 主分类号: H01L21/82
- IPC分类号: H01L21/82 ; H01L21/3205 ; H01L21/70 ; H01L27/02 ; H05K3/00 ; H01L21/308 ; H01L21/77
摘要:
A semiconductor device having two or more unit circuit-blocks is produced by (a) forming in a chip area on a substrate two or more circuit-blocks by repeating, a required number of times, a process comprising exposing in sequence each block section within each chip area coated with a resist film, using masks for making respective circuit-blocks, developing a resist pattern, and a subsequent process using the pattern, and (b) forming external interconnections between the circuit-blocks using a resist pattern formed over the circuit-blocks.
公开/授权文献
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