This invention pertains to an addition-curable silicone adhesive composition that is extrudable and flowable at room temperature in the absence of a solvent comprising (A) 40 to 95 parts of an alkenyl functional siloxane resin consisting essentially of R.sub.3 SiO.sub.1/2 siloxane units and SiO.sub.4/2 siloxane units, wherein R is a monovalent hydrocarbon radical having 1 to 6 carbon atoms; there being from 0.5 to 1.5 R.sub.3 SiO.sub.1/2 units for every SiO.sub.4/2 units; said resin containing 0.01 to 22 wt % alkenyl functionality; (B) 0.5 to 10 parts of an SiH containing polyorganosiloxane having an average of at least 2 silicon-bonded hydrogen atoms per molecule and having a viscosity of 0.8 to 2,000 mm.sup.2 /s; (C) a hydrosilylation catalyst in sufficient quantity to promote curing of said composition; (D) optionally, up to 70 parts of a polydiorganosiloxane having at least two ethylenically or acetylenically unsaturated groups per molecule and having a viscosity of 100 to 80,000 mm.sup.2 /s; and (E) optionally, an inhibitor in sufficient quantity for the composition to be stable at room temperature in the absence of oxygen and SiH reactive hydroxylated compounds.