发明授权
US5700704A Process for fabricating a semiconductor integrated circuit device 失效
半导体集成电路器件的制造方法

Process for fabricating a semiconductor integrated circuit device
摘要:
A method is provided for manufacturing a semiconductor integrated circuit device which includes a capacitor element having a first electrode, a second electrode, and a dielectric film formed between said first electrode and said second electrode. In particular, the method includes the step of forming at least one of the first electrode and second electrode with a polycrystalline silicon film which is deposited over a semiconductor substrate by a CVD method and which is doped with an impurity during said deposition to decrease the resistance of the polycrystalline silicon film. The capacitor element formed by this method is particularly useful for memory cells of static random access memory devices.
公开/授权文献
信息查询
0/0