发明授权
US5702584A Enhanced plating adhesion through the use of metallized fillers in
plastic substrate
失效
通过在塑料基材中使用金属化填料增强镀层附着力
- 专利标题： Enhanced plating adhesion through the use of metallized fillers in plastic substrate
- 专利标题（中）： 通过在塑料基材中使用金属化填料增强镀层附着力
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申请号： US675308申请日： 1996-07-01
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公开(公告)号： US5702584A公开(公告)日： 1997-12-30
- 发明人: Lakhi N. Goenka , Michael G. Todd , Andrew Z. Glovatsky
- 申请人： Lakhi N. Goenka , Michael G. Todd , Andrew Z. Glovatsky
- 申请人地址： MI Dearborn
- 专利权人： Ford Motor Company
- 当前专利权人： Ford Motor Company
- 当前专利权人地址： MI Dearborn
- 主分类号： B29C37/00
- IPC分类号： B29C37/00 ; B29C70/64 ; C23C18/16 ; H05K3/38 ; C25D5/54 ; B05D3/04 ; C25D5/56
摘要：
A polymer substrate is plated with a metal, using metallic filler particles in the polymer as anchorage points for a layer of metal formed by an electroless plating operation. The polymer has a filler that includes non-metallic filler particles and metallic filler particles; the non-metallic filler particles contiguous to the polymer surface can be etched away, so as to expose metallic filler particles proximate to the etched surfaces. The exposed metallic filler particles serve as anchorage points for the electroless plate layer.
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