发明授权
US5713744A Integrated circuit socket for ball grid array and land grid array lead
styles
失效
集成电路插座用于球栅阵列和阵列阵列引线样式
- 专利标题： Integrated circuit socket for ball grid array and land grid array lead styles
- 专利标题（中）： 集成电路插座用于球栅阵列和阵列阵列引线样式
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申请号： US314011申请日： 1994-09-28
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公开(公告)号： US5713744A公开(公告)日： 1998-02-03
- 发明人: Michael Frederick Laub
- 申请人： Michael Frederick Laub
- 申请人地址： DE Wilmington
- 专利权人： The Whitaker Corporation
- 当前专利权人： The Whitaker Corporation
- 当前专利权人地址： DE Wilmington
- 主分类号： H01R12/04
- IPC分类号： H01R12/04 ; H05K7/10 ; H01R9/09
摘要：
Injection molded insulating strips receive a plurality of contacts. The strips are stacked together to create a multiple row, multiple column contact array. The contact array is adapted for use in an IC socket to separably connect an IC having either an LGA or BGA package lead styles. A cover plate, locator, array frame, and contact array together comprise a manufacturable and low cost separable IC socket.
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