发明授权
- 专利标题： Semiconductor device
- 专利标题（中）： 半导体器件
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申请号： US721240申请日： 1996-09-26
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公开(公告)号： US5714405A公开(公告)日： 1998-02-03
- 发明人: Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
- 申请人： Kunihiro Tsubosaki , Michio Tanimoto , Kunihiko Nishi , Masahiro Ichitani , Shunji Koike , Kazunari Suzuki , Ryosuke Kimoto , Ichiro Anjoh , Taisei Jin , Akihiko Iwaya , Gen Murakami , Masamichi Ishihara , Junichi Arita
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Hitachi, Ltd.,Hitachi Microcomputer Systems, Ltd.
- 当前专利权人： Hitachi, Ltd.,Hitachi Microcomputer Systems, Ltd.
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX2-153183 19900611; JPX2-198462 19900726
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L23/495 ; H01L25/10 ; H01L21/60
摘要：
A semiconductor device having inner leads secured via insulating adhesive films to the principal surface of a semiconductor chip and electrically connected to the respective external terminals of the semiconductor chip. The semiconductor device that can be about the size of the chip is so configured that an outer lead is continuously extended from each inner lead up to the rear surface opposite to the principal surface of the semiconductor chip in order to hold the leads and an external device in conduction.
公开/授权文献
- US4872836A Releasable extraoral orthodontic appliance 公开/授权日：1989-10-10
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